Koch-Chemie Polishing & Sealing Pad
The Koch-Chemie Polishing & Sealing Pad is made from extra fine sponge designed to economically and evenly apply sealing products such as Koch-Chemie 1K Nano. The short height of 23mm creates low torsion forces whilst providing a high level of stability and excellent handling. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.